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IN CASE YOU MISSED IT
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Dscoop features fireside chat with Alon Bar-Shany
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Dscoop Phoenix highlights latest technologies
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Nearly 2,400 people turned out at Dscoop Phoenix to see the latest in printing and finishing.
View the Slideshow >>
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Mark Andy to host Open House in Poland
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The event will take place at the digital and flexo press manufacturer's Warsaw showroom and demo center April 5-7, 2017.
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TLMI Eugene Singer Award winners announced at Converter Meeting
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Columbine Label, Electronic Imaging Materials, The Label Printers and Consolidated Label were recognized in St. Pete Beach.
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Grand Opening Event announced for Flint Group Narrow Web's Center For Technical Excellence
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The event will take place June 14-16, 2017 in Rogers, MN, just outside of Minneapolis. |
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Omet to highlight packaging at Open House
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The event, scheduled for March 20-21, will feature the launch of the Varyflex V4 Offset. |
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Domino Open House provides table-top exhibit opportunities
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The event offers two days of visibility, networking and educational conversations with customers, prospects and peers. |
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MacDermid and Comexi announce open house agenda
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It will bring together industry leading suppliers to discuss and present on productivity enhancements in flexo printing. |
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In-mold Labeling and Decorating Seminar set for Chicago
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The "ABC's of IML: A Basic Course," now in its 28th year, will be presented Thursday, May 4, 2017. |
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ICE USA offering education for every level of experience
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The event will feature a strong line-up of keynote speakers, industry fundamental workshops and technical education sessions. |
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AWA bringing sleeve label conference to Miami
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The April event will show how this relatively young technology is genuinely enhancing the value of brands. |
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INFO*FLEX nearly sold out
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Only 10 booths remain for the show, which will take place May 1-2 in Phoenix, AZ, USA. |
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Agfa Graphics to highlight brand protection at Xeikon Café
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Agfa will join close to 40 other industry suppliers to show total solutions of digital applications in labels and packaging. |
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PMMI reports successful Pack Expo East in Philly
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The prime Philadelphia location placed Pack Expo East within 200 miles of one-third of US consumer packaged goods companies. |
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uv.eb West 2017 celebrates record attendance
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The event was presented by RadTech from February 27 to March 1 in San Francisco, CA, USA. |
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Dscoop keynotes inspire imagination among attendees
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Three keynote presentations were delivered by Oakland A’s GM Billy Beane, the Blue Angels' John Foley and Disney's Doug Lipp.
Read the Exclusive >>
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Keynote presentations spark imagination at Dscoop
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